Chip component terminal electrode coating device
Fully automatic terminal-equipped (dipping) device
· Applications for small chip products such as MLCCs, chip inductors, and chip resistors · Full automation (including dipping, drying furnace, and discharge) · Capable of handling various shapes with equipment modifications · Achieves high productivity, accuracy, and yield · User-friendly touch panel and PC operation for operators
- Company:マイクロ・テック
- Price:10 million yen-50 million yen